FOUP/FOSB Full-Automatic Cleaning System For 300mm Wafer
Patented vacuum drying technology realized complete dry after FOUP cleaning.
External dimension : D4, 150×W4,900×H3,000mm
Processing ability : over 12 units/hour
Weight : below 4000kg
Power source : φ3 AC200V±10% 30kVA
CDA/N2:0.5MPa 4000L/min
Ultrapure water : 20L/min
Automatically supply FOUP by AMHS, or manual supply possible.
Wash-dry tank : 2 / Vacuum drying tank : 4
6 axis articulated robot (Servomotor drive)
Vacuum Drying System
Patented vacuum drying technology realized complete dry of product.
External dimension : D900×W1,200×H1,840mm
Chamber inside dimension : D600×W700×H950mm
Power source : φ3 AC200V±10% 50/60Hz
Power consumption : 12KW
DA pressure : 0.5MPa
Cooling water : 5L/min
Dry Pump:3,000L/min
Chamber cleanliness : Class 10
Ultimate vacuum pressure : 20Pa
Ammonia Diluting / Supplying System
System designed to blend various chemicals and supply.
Dilute and blend fluoric acid, ammonia water, etc.
and supply to cleaning system from buffer tank.
High precision weighing method enables to form low density HF solution, etc. Layout design to facilitate to replace consumables such as pump, etc. and reduce maintenance work load.
Container Cleaning System
Developed for precision cleaning of 300mm wafer shipping container(FOSB) and FOUP.
System incorporated various know-how required for wafer container cleaning.
Realized high throughput by spray cleaning with high function cleaning agent, air blow water-off, etc. Exhibit same performance also in cleaning of other container such as Open Cassette, SMIF Pod, etc. as well as FOSB/FOUP.
Function as dedicated machine to each work by cleaning jig and most suitable nozzle design/layout corresponding to each work.
12" Cassette-less Cleaning System
Has 300mm wafer cassette-less processing capacity in maximum 50-wafer half pitch/batch. Perform wet-in/dry-out and dry-in/dry-out.
Full automatic operation is available by host communication.
Fully customized system for cleaning process with flexible tank configuration designed to meet various cleaning needs.
Many actual achievements as mass production system.
4"/5"/6"/8" Wafer Etching System
System capable of processing multi-size wafer, 4", 5", 6" and 8" wafer.
Designed rigid to be compatible with high temperature ozone sulfate.
2 sets of built-in spin dryer capable of drying 2 sizes, thus dry 4 sizes.
As size is automatically judged and tooling change is not necessary, suitable for small lot production.
6"/8" Cassette-less Cleaning System
Capable of performing cassette-less process of both 6" wafer and 8" wafer.
For drying process, original lift-up drying system is equipped, and 2-size multi-design requires no tooling change. In addition to 6/8" , system for both 5/6" also can be produced.
Large Part Precision Cleaning System
Large system for precision cleaning of metal parts. Perform setting part in basket and ultrasonic cleaning in large dipping tank. For rinsing, usable for complicated shape by jet flow method with special nozzle. For drying, in addition to hot air circulation with built-in HEPA filter, air blow system by movable nozzle is adopted. Restrain waterdrop from being carried into oven.
Wafer・Chip Appearance Inspection System
Wafer・Chip Apperance Inspection System / Realized labor saving by high throughput Micro-crack・Chipping・Foreign Matter Inspection・Pattern Defect, etc.
For Si Wafer, Compound Wafer, Glass, etc.
/ Inspection of Warped wafer・Post-dicing chip
- Automatic judging function : Map data saving function
- Resolution : 1.5μm
N2 Compact Size Reflow
Total length : 2.5mm, 6 zones, Realized compact size/For package such as BGA/CSP, etc.
- Max 350℃(±2.5℃)
- Applicable size: Max250×230mm
- In-oven oxygen density : 50ppm~
- 3phase, 200V 20kW
- Hot air circulation + Far-infrared usable
- Outer dimension : 2500×1040×1340mm
Table-top N2 Reflow System
Conveyer type & Batch type, Heating oven / Max 400℃, Max width : 340mm
- With window to observe the inside of oven
- 200VAC 3phase 50/60HZ
- Nitrogen gas, With excessive temperature rise prevention sensor
PC Substrate Cleaner
Remove dust・powder・burr on printed substrate / Rotating brush+Suction unit type
- Rotating brush+2 rubber rolls+Adhesive tape
- Width 50~250mm/Length 100~330mm
- Object thickness : 0.5~2.0mm
- Outer dimension : 620×390×1260mm
- Connectable to front- and back-end of SMT line system
- Using both neutralizing apparatus (Top of inlet/outlet) and air-blow
Laser Scriber
Scriber for sapphire, GaN, SiC and crystal wafer, etc.
- High-speed throughput
- Realized 800mm/sec
- Debris-less process
- Usable for warp・uneven thickness of wafer
- For Φ2~Φ6 inch ※Patent Pending
RSP-150 Manual Opener
This is a jig to manually open and close RSP-200 (Reticle SMIF Pod).
Possible to open/close by placing RSP-150 on Opener (this product) and moving handle lever left and right.
- Main material : Alminum alloy / SUS
- Outer dimension : 355(W) x 421(D) x 171(H)mm
※421mm includes handle lever rotation area - Weight : approx. 6kg
RSP-200 Manual Opener
This is a jig to manually open and close RSP-150 (Reticle SMIF Pod).
Possible to open/close by placing RSP-200 on Opener (this product) and moving handle lever left and right.
- Main material : Alminum alloy / SUS
- Outer dimension : 369(W) x 427(D) x 127(H)mm
※427mm includes handle lever rotation area - Weight : approx. 4.5kg
FOUP Manual Opener
This is a jig to manually open and close FOUP (Front Opening Unified Pod) for 300mm wafer.
Possible to open/close by setting Opener (this product) on FOUP DOOR and rotating the handle (right).
The removed DOOR can be temporarily placed in an upright position to maintain cleanliness.
- Main material : Resin (engineering plastic)
- Outer dimension : 453(W) x 83(D) x 173(H)mm
※173mm includes handle - Weight : approx. 850g